SMD Component Package Sizes: A Comprehensive Guide

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One of the most crucial things you come across when you get deeply into the production of Printed Circuit Boards (PCB) is surface mount device (SMD) parts. Surface-mount devices (SMDs) are a necessary parts of modern electronics because of their efficiency, small size, and simplicity of automation in assembly. Therefore, a detailed understanding of SMD packages components is crucial.

This blog will walk you through the SMD component's packages sizes, compatibility and how this can impact your PCB designs.

Why Package Size Matters

There are multiple components of your PCB that are affected directly by the SMD package size:

Board Space: As the components and packages size have been reduced significantly in recent days, more components can be adjusted and assembled onto the restricted board surface.

Assembly Efficiency: The assembly machines, which are designed to pick and place, can handle larger packages more quickly, which reduces the assembly and material handling time and production cost on assembly.

Performance: The heat dissipation capability is directly proportionate with the packages size. Therefore, bigger packages offer better heat management for components with a lot of power.

Cost: Due to larger packages, faster assembly and less material usage is possible, the overall cost can be reduced.

Navigating SMD Package Sizes

A few typical types of SMD package sizes are listed below:

Capacitors and Resistors: These passive parts are available in the most varied sizes. For high-density boards, there's the popular "" (0.6 mm x 0.3 mm) and the bigger "" (3.2 mm × 1.6 mm) for improved handling and power dissipation.

Inductors: The inductance value and current rating determine the size of the SMD inductor. For low-profile uses, go with a smaller alternative such as a "" (1.0 mm x 0.5 mm), while for higher inductance requirements, go with a bigger "" (3.2 mm × 2.5 mm) box.

Diodes and transistors: These active components commonly use the SOT package family. A bigger "SOT-223" (6.7 mm x 3.7 mm) is appropriate for higher power applications, while the more popular "SOT-23" (2.9 mm × 2.4 mm) strikes a nice compromise between size and functionality.

Integrated Circuits: The sizes and forms of IC packages are extremely varied. For high-density connections, common solutions include the Quad Flat Pack (QFP) with square leads on both sides, the Small Outline Integrated Circuit (SOIC) with gull-wing leads, and the Ball Grid Array (BGA) with solder balls underneath the package.

Below table will give you a comprehensive comparison (Ref-1 & Ref-2).

Selecting the Right SMD Package Size:

Choosing the optimal SMD package size involves a delicate balance between various factors:

Board Space Constraints: Minimalist components, such as "" resistors or "SOT-23" transistors, are ideal when board space is limited. Nevertheless, make sure that these little parts can be reliably handled.

Performance Requirements: To improve heat dissipation performance, select larger packages such as "SOT-223" transistors or "" resistors for high-power components.

Manufacturability: You need to think about how well you do the assembly design. In the case of smaller packages, the cost depends on the expertise and tooling requirements for manufacturing. It is essential to balance miniaturization and efficient assembly.

Even though you want to use smaller components and packages, make sure about the easy availability of the components. Otherwise, your supplier will find it hard to meet the delivery timeline. Moreover, if you want to keep production on schedule, it is a wise decision to use easily accessible packages with larger sizes.

Get in touch with the PCB Power if you have questions. Our assembly capabilities and team of experts will give their insightful recommendations.

Advanced SMD packages

The world of SMD packages extends beyond basic rectangular shapes. Here's a glimpse into some advanced options:

Leadless Chip Carrier (LCCC): A leadless chip carrier (LCCC) is a rectangular or square packages that has solder bumps on the bottom for connections with a high density.

Ball Grid Array (BGA): By arranging solder balls beneath the whole device, Ball Grid Array (BGA) provides even greater density and superior electrical performance. Nevertheless, specialized assembly procedures are necessary for BGAs.

Quad Flat No-Lead (QFN): Compared to BGA, Quad Flat No-Lead (QFN) has better mechanical stability thanks to leads that extend from each of the four corners.

Although they necessitate sophisticated assembly methods and meticulous design, these advanced packages are perfect for space-constrained high-performance devices.

Final Words:

Knowing the sizes of SMD packages can help you make better decisions about PCB design, component sourcing, and assembly. It takes considerable thought to balance space constraints, performance needs, manufacturability, and component availability when selecting the ideal package size for your project. Keeping open lines of communication with your PCB manufacturer and component suppliers is essential to ensure an efficient and effective PCB assembly process.

Contact us today to learn more about our services and how we can help bring your electronic designs to life.

Ref-1: - Electronics Notes

Ref-2: Zaxis

For more information, please visit Standard Smd Sizes.

Contents

Surface-mount devices are mounted directly to a PCB. These SMD components are smaller than the through-hole components and comprise a small lead or no lead at all. Since SMD components require fewer drilled holes, they incorporate higher routing density, and the design becomes more compact.

There are many SMD components of different package sizes with various functionalities. They can be placed on both sides of the circuit board along with a higher component density, with more connections possible per component to attain higher speed. Here, we will briefly introduce some of them.

SMD package sizes for resistors, capacitors, inductors, and diodes

SMD passive components consist of resistors, capacitors, and inductors with a rectangular package. Diodes are also part of this but are two-terminal active devices. Diodes can be miniaturized and packaged according to the following SMD sizes.

Chip package typeDimensions in mmDimensions in inches .4 x 0.20.016 x 0.008 .38 x 0.380.014 x 0.014 .6 x 0.30.02 x 0.01 .5 x 0.50.019 x 0.019 .6 x1.00.02 x 0.03 .8 x 0.80.03 x 0.03 .0 x 0.50.04 x 0.02 .5 x 0.80.06 x 0.03 .0 x 1.30.08 x 0.05 .5 x 2.00.10 x 0.08 .8 x 2.80.11 x 0.11 .0 x 1.50.12 x 0.06 .2 x 2.50.125 x 0.10 .5 x 1.60.18 x 0.06 .5 x 2.00.18 x 0.07 .6 x 3.00.18 x 0.125 .5 x 6.40.18 x 0.25 .0 x 2.50.20 x 0.10 .3 x 3.20.25 x 0.125 .9 x 6.30.27 x 0.25 .4 x 5.10.29 x 0.20

Comparison of different SMD components

It&#;s crucial to select the right SMD components that not only fit into your design but also fulfill its intended purpose effectively. The table below provides a comparison among commonly used SMD components:

PackagesDimensions (mm)ApplicationsComponent typeNumber of pins SMA3.56 x 2.92RF and microwave devicesDiode2 DO-.30 x 6.10Power rectification diodesDiode2 DO-213AA4.57 x 3.94Small signal transistors and diodesDiode2 SMC5.94 x 5.41Integrated circuits, resistors, and capacitorsDiode2 TO-.85 x 3.85Power MOSFETs and voltage regulatorsMOSFET3 MBS2.60 x 1.90Switching diodes and high-density integrated circuitsDiode2 SOD-.60 x 1.90Small signal diodes and transistorsDiode2

1.6 × 0.8

Consumer, automotive, and industrial equipmentResistors, capacitors, and inductors2 .0 × 1.25Consumer, automotive, and industrial equipmentResistors, capacitors, and inductors2
3.2 × 1.6
Consumer, automotive, and industrial equipmentResistors, capacitors, and inductors2

Surface-mount PCB connectors

An electronic project is incomplete without a proper connector. In surface-mount technology, SMA and SMB connectors are mostly used for board assembly. SMA and SMB stand for sub-miniature version A and sub-miniature version B.

TypePropertiesApplication SMA1. Semi-precision
2. Coaxial RF connector
3. Impedance 50&#;
4. Electrical use from DC (0 GHz) to 12 GHz,
but extended to 18 GHz and 26.5 GHz1. Microwave systems
2. Hand-held radio
3. Mobile antennas
4. WiFi antenna systems SMB1. Semi-precision
2. Coaxial RF connector
3. Impedance 50&#; or 75&#;
4. Electrical use from DC(0 GHz) to 4 GHz
5. Smaller than SMA1.Telecommunications
2. Test equipment
3. Instrumentation
4. GPS

 

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• Basics
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Common SMD Tantalum capacitor sizes

Tantalum capacitors do have very high capacitance with very small packaging. These capacitors give the best results in high-capacitance, low-current environments.

Package typeDimensions in mmEIA standard Size A3.2 x 1.6 x 1.6EIA -18 Size B3.5 x 2.8 x 1.9EIA -21 Size C6.0 x 3.2 x 2.2EIA -28 Size D7.3 x 4.3 x 2.4EIA -31 Size E7.3 x 4.3 x 4.1EIA -43

Small outline transistor package types

A small outline transistor is a discrete surface-mount transistor that is majorly used in consumer electronics. Here are some commonly used SOTs.

Package typeDimensions in mmTerminal SOT-233 × 1.75 × 1.33 SOT-.7 × 3.7 × 1.84 SOT-.1 x 2.1 x 0.94 SOT-.6 x 1.6 x 0.74

Other SMD transistors

We can see some popular SMD transistors other than SOT here.

TO-252-3 (DPAK)

 

TO-263

Integrated circuit SMD packages

ICs are enclosed in a package for protection. Here, we will see some important IC packages, their properties, and applications.

Package type

PropertiesApplication SOIC1. Small outline integrated circuit
2. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package)1. Standard package for logic IC TSSOP1. Thin shrink small outline package
2. Rectangular surface mount
3. Plastic integrated circuit (IC) package
4. Gull-wing leads1. Analog amplifiers,
2. Controllers and Drivers
3. Logic devices
4. Memory devices
5. RF/Wireless
6. Disk drives QFP1. Quad flat package.
2. Easiest option for high pin-count components
3. Easy to inspect by AOI
4. Assembled with standard reflow soldering1. Microcontrollers
2. Multi-channel codecs QFN1. Quad flat no-lead
2. Electrical contacts do not come out of the component
3. Smaller than QFP
4. Require extra attention in PCB assembly1. Microcontrollers.
2. Multi-channel codecs PLCC1. Plastic leaded chip carrier
2. Allow components to be directly mounted on the PCB1. Prototype PCB assembly BGA1. Ball grid array
2. Most complex
3. High-pin count component
4. Electrical components are below silicon IC
5. Requires reflow soldering for PCB assembly1. High-speed microprocessor
2. Field programming gate array(FPGA) POP1. Package-on package technology
2. Stacked on the top of others1. Used for memory devices and microprocessors.
2. High-speed design, HDI design

SMD components ensure a smaller form factor design. The manufacturing cost is minimized, and board space can be efficiently optimized by incorporating these components. Indeed, SMD packages are the better choice over through-hole components when designing a sleek, compact, high-speed, or HDI board.

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